By Chuan Seng Tan (auth.), Abbas Sheibanyrad, Frédéric Pétrot, Axel Jantsch (eds.)
Back hide replica sequence: built-in Circuits and platforms 3D-Integration for NoC-based SoC Architectures via: (Editors) Abbas Sheibanyrad Frédéric Petrot Axel Janstch This booklet investigates at the grants, demanding situations, and strategies for the 3D Integration (vertically stacking) of embedded structures hooked up through a community on a chip. It covers the complete architectural layout technique for 3D-SoCs. 3D-Integration applied sciences, 3D-Design innovations, and 3D-Architectures have emerged as subject matters serious for present R&D resulting in a vast diversity of goods. This booklet provides a complete, system-level assessment of third-dimensional architectures and micro-architectures. •Presents a entire, system-level evaluate of 3-dimensional architectures and micro-architectures; •Covers the total architectural layout process for 3D-SoCs; •Includes cutting-edge remedy of 3D-Integration applied sciences, 3D-Design options, and 3D-Architectures.
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Additional info for 3D Integration for NoC-based SoC Architectures
B. P. Pande. Networks on chip in a three dimensional environment: A performance evaluation. IEEE Transactions on Computers, 58(1), 2009. html â•‡ 8. F. Li, C. Nicopoulos, T. Richardson, Y. Xie, V. Narayanan and M. Kandemir. Design and management of 3 D chip multiprocessors using network-in-memory. ACM SIGARCH Computer Architecture News, 34(2):130–141, 2006. â•‡ 9. G. Loh. 3D-stacked memory architectures for multi-core processors. Proceedings for the 35th ACM/IEEE International Symposium on Computer Architecture (ISCA), 2008.
5 shows this effect for a 3D16 topology. 4 for 180Â€nm technology, it grows to a factor of 34 for a 17Â€nm technology. Hence, even if a 3-D topology can mitigate the cost of centralized memory, it is still growing exceedingly as technology advances due to the inverse effect on the performance of logic versus interconnect as a result of scaling. 6 shows the cost of having part of the memory off-chip. At ωâ•›=â•›1 all memory is on-chip. 2 Fig. 4â†œæ¸€ The effect of the memory distribution factor Δ on ECE for different topologies 0 38 A.
S. L. S. W. Pease, Low Temperature Budget Processing for Sequential 3-D IC Fabrication. Â€707, 2007. 20. html 21. M. Bohr, The New Era of Scaling in an SoC World. Â€23, 2009. 22. S. J. Gutmann, and R. Reif, Wafer Level 3-D ICs Process Technology, Springer, New York, ISBN 978-0-387-76532-7, 2008. 23. P. Garrou, C. Bower, and P. Ramm, Handbook of 3D Integrations: Technology and Applications of 3D Integrated Circuits, Wiley-VCH, Weinheim, ISBN 978-3-527-32034-9, 2008. 24. A. Fan, A. Rahman, and R.
3D Integration for NoC-based SoC Architectures by Chuan Seng Tan (auth.), Abbas Sheibanyrad, Frédéric Pétrot, Axel Jantsch (eds.)