Anwendung von RFID-Systemen, 1.Auflage - download pdf or read online

By Christian Kern

ISBN-10: 3540277250

ISBN-13: 9783540277255

Die Radio-Frequenz-Identifikation (RFID) dient seit etwa 15 Jahren zur Identifikation von Personen, Objekten und Tieren. Mit der inzwischen intestine entwickelten Technologie k?nnen heute Rationalisierungen in vielen Wirtschaftsbereichen erreicht werden. Das Buch bietet eine Darstellung bestehender Anwendungen und Technologiegrundlagen sowie eine Beschreibung der M?glichkeiten und Grenzen von RFID. Es soll dem Projektleiter zugleich als Leitfaden f?r die Auswahl geeigneter RFID-Systeme dienen. Eine Abgrenzung von Funktionseinheiten ist in einer Systembetrachtung enthalten. Der Leser wird in die Lage gebracht, eine RFID-Anwendung von der Idee bis zur Praxis aufzubauen und die richtigen Ressourcen zusammenzustellen. Im Anhang aufgef?hrt sind: Firmen, die im Bereich RFID t?tig sind, eine ?bersicht zu bestehenden Anwendungen in verschiedenen Branchen sowie Gremien und Institute, die sich mit RFID besch?ftigen und kompetente Beratung geben k?nnen.

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Unfortunately, with the finer pitch packages, the assembly and the attachment to the PWB became increasingly more difficult. Alignment and placement problems became more demanding, as did the stencil printing of the solder paste. In addition, the very fine pitch packages often experienced leads shorting because of the reduced spacing between the leads. And of course the problem of maintaining planarity of the leads was magnified, making handling of the packages more difficult. 2 — Area Array Packages—PGA, BGA Use of peripheral pads with increasing I/O count unfortunately meant larger packages This brought about another paradigm shift in package I/O format from the traditional peripheral to an area array layout that allowed pads to be placed within the body (bottom surface) of the package (Figure 3-6).

Ceramic BGA Configurations Ceramic BGAs can be supplied with solder bumps or solder columns (typically high lead 5Sn95Pb) as shown in Figure 3-10. The solder column provides for increased gap between the package and the substrate and greater solder volume. 0) reliability. (Courtesy IBM) Figure 3-10. 2 — The Plastic Ball Grid Array, PBGA Increased IC I/O count is the result of increased device functionality, which in turn means more complex packages with higher wiring density within the package.

1 — Impact of I/O Count at Chip Level An increase in number of I/O pads, the result of increased functionality, requires a significant change in the physical layout of the IC. Accommodating I/O count means changes in the IC’s I/O pad size, pitch and overall format. Traditionally, I/O pads have been positioned along the perimeter of the chip, 100 micrometers square on 200-micrometer pitch. This peripheral format has always been ideal for chip and wire assembly and as a result a huge infrastructure to support this technology is currently in place.

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Anwendung von RFID-Systemen, 1.Auflage by Christian Kern


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